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Tekdata offer a range of Application based connectors.
The following covers some of the applications:
- Space envelope and shape can be determined within the layout
- High voltage between connector pins can be achieved using a special moulding.
- ‘Make’ power before signal contact principle can be designed in
- Environmental requirements such as IP rating or ‘O’ ring sealing can be achieved
- Connector backshell can be an integral part of the design
- ZIF can be accommodated
- Pin protection can be designed in on both plug and socket types